Die Technology

News


May 2008

Introducing LPV324 Bare Die Product
Ultra Low Power Consumption Operational Amplifier


The LPV324 bare die is a low power (9 µA per channel at 5.0V) version of the LMV324 op amp and is particularly suited for Medical Sensing applications.

The LPV324 bare die is the most effective solution for medical applications where low voltage, low power operation and space saving are critical. The LPV324 bare die has rail-to-rail output swing capability and the input common-mode voltage range includes ground. The LPV324 bare die exhibits excellent speed-power ratio, achieving 5 kHz of bandwidth with a supply current of only 9 µA.

Designing medical applications with the LPV324 in die form also allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal integrity.

The chip is built with National's advanced submicron silicon-gate BiCMOS process. The LPV324 has bipolar input and output stages for improved noise performance and higher output current drive.


Quick Reference Data



Supply Min 2.7 Volt
Supply Max 5 Volt
Gain Bandwidth 0.152 MHz
Offset Voltage max, 25C 7 mV
Max Input Bias Current 60 nA
Channels 4 Channels
Supply Current Per Channel 0.0075 mA
PowerWise Rating 2 49.3 uA/MHz






Features


(For V+ = 5V and V- = 0V, typical unless otherwise noted)

Guaranteed 2.7V and 5V performance
No crossover distortion
Bare Die smallest form factor 610μm x 965μm
Reduced interconnect increases mechanical reliability
Industrial temperature range -40°C to +85°C
Gain-bandwidth product 152 kHz
Low supply current 28 µA
Rail-to-rail output swing @ 100 k. Load V+-3.5 mV V-+90 mV
VCM -0.2V to V+-0.8V
Bare Die smallest form factor 610µm x 965µm








Applications

  • Medical Active Filters
  • Low Voltage Medical Applications
  • Portable Medical devices

A full electrical datasheet is available from http://www.national.com/ds/LP/LPV321.pdf

For further die technical information please contact us



surface mount, chip on board, flip chip comparisions
LPV324 Datasheet screen shot
Please contact us if you would like a copy of the die geometry.



Die in waffle tray















Die in gel pak















Wafer form
















Wafer on foil















Die on tape reel









Die Distributor For : National Semiconductor | Analog Devices | Fairchild | International Rectifier | Micrel | Texas Instruments
ISSI | Microsemi | On Semiconductor | Intersil | Zetex | Linear Systems | Sensitron | Vishay

Die Technology are a member of the ASC Group Europe