Die Technology Ltd was formed in 1983 and to this day is still at the forefront in die processing for the hybrid industry.  Together with our sister company Mintech Semiconductors Ltd, we have grown to become probably the largest die processor worldwide.  From originally servicing a specialist hybrid marketplace we have grown in terms of capability and volume and now use our die expertise to address other markets such as automotive, industrial, space, defence, medical and commercial.  As the trend towards bare die use continues, Die Technology Ltd is geared towards meeting the volume demands of these growing markets.

Die Technology holds franchised distribution lines with world market leaders such as National Semiconductors, Fairchild, Texas Instruments, Analog Devices, Intersil and many more. 

We specialise in the supply of un-encapsulated die in many formats from waffle tray, Gel-Pak, Uncut Wafer and Wafer on Foil (cut or uncut) to Tape & Reel for higher volume applications.

Other services offered include LAT/Lot Qualification, Wafer Probing and Die Banking (see our Capabilities section for more information).

Ditech is committed to providing the highest levels of quality, both in product and customer service.  We operate to the recognised ISO9001:2000 standards and continually monitor our quality procedures.