Sub Contract Die Processing - The concept

Why would you have your material processed by a third party?

• Cost Economic sense

• Need for expertise and experience

• need for necessary equipment or training

• Assurance of post-supply support

In today's changing marketplace many customers are finding it cheaper to outsource parts of their manufacturing process.  This could occur when a company isn't geared up to deal with the volume, i.e. if the volume is too low it simply is not worth buying the expensive equipment needed to set-up a working clean room operation.  On the other hand should volume be too high it often simply works out to slow and expensive to process parts in house if capacity is limited.  A different (and often more expensive in the long term!)  cost to consider is the time lost and possible problems created by failing to meet customer supply dates.  For example, a company growing fast can quickly run out of manufacturing capacity to meet it's commitments.  Volume suppliers such as Die Technology can step in quickly and offer a fast solution at a lower overall cost to the customer. 

Customers also contract out die processing because of the complexity involved in the process.  Due to the many variables involved from the initial saw of the silicon through to handling and release of end product it is neither easy to successfully carry out the process without significant prior experience.  Often a customer could be set to lose more through yield loss trying to process their product than if they passed the job directly to an experienced die handler. 

Not all companies are specialised enough to have the equipment on-site necessary for appropriate processing, storage and handling of semiconductor product.  Safe die handling and inspection abilities cannot be learnt over night and it requires considerable experience and training for an employee to reach the necessary level of competency across a range of product types.  By using third party expertise a companies business is not restricted as they can still roadmap a product through circuit design, fab, and supply to end customer.  A current demonstration of this is the rapidly growing fabless semiconductor industry.

Another motivation towards the outsource of die processing is linked to reliability and overall product support.  A customer who is willing to entrust their product to a third party has complete confidence in the processor and looks at them as a working partner in the supply chain both before and after processing.  Die Technology can also support the product after shipment by having both a good understanding of what should be happening next to the silicon and also the required experience to troubleshoot any issues arising at the assembly end.

Sub Contract Die Processing - The Process

The customer specification for the die process is received and assessed by an engineer.  Once the engineer is happy he/she has all the details necessary the specification is then computerised and logged onto the computer system  (the hard copy is then scanned for additional traceability).  By locking the process into a computerised Workflow all process conditions are set and all necessary shop floor documentation is generated by this method.  Where the customer specification is deemed to be insufficient for either processing or storage methods the engineer can advise the customer on the most appropriate solution for their end requirement. 

Sub Contract Die Processing - Capabilities

Consultancy
We will provide consultancy when required for the handling of a die processing project.

Storage
Product storage in the perfect conditions.  Dedicated storage for customer own product.

Wafer Sawing
Silicon and Gallium Arsenide up to a maximum size of 8".  Processed either to a standard flow or to customers own specification.

Wafer Inking
A customers wafer can be probe tested to their specification and the reject die inked.

Inspection
To any recognised standard and also to customers own specification.

Supply Forms
Die in waffle pack, Die in Gel Pack, Unsawn wafer, Unsawn wafer mounted on foil, Wafer sawn on foil, Tape & Reel.

Testing
Product can be electrically screened to a customers specification. 
Element evaluations can be performed in accordance with a recognised standard or customer specification.

Packaging
Parts can be packaged and also tested as per customer specification

Full Traceability
All product movement is logged by computer.  Records can be stored indefinitely.

Stock Enquiries
Customers can receive computerised inventory reports at any time in whatever output form they need.